qw -bp014 comchip t echnology co., l td. page 1 rev :c d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) s o t - 5 2 3 3 1 2 0.067(1.70) 0.059(1.50) 0.033(0.85) 0.030(0.75) 0.043(1.10) 0.035(0.90) 0.031(0.80) 0.028(0.70) 0.013(0.33) 0.006(0.15) 0.008(0.20) 0.004(0.10) 0.069(1.75) 0.057(1.45) 0.004(0.10) max 0.01 1(0.28) min rohs device cpdh3-5v0u -iec61000-4-2 8kv(contact), 15kv(air). -surface mount package. -high component density . mechanical data -case: sot -523 standard package, molded plastic. -t erminals: gold plated, solderable per mil- std-750d, method 2026. -marking code: e5u features -mounting position: any . - w eight: 0.0028 gram (approx.). t yp parameter min max unit junction capacitance diode breakdown voltage v esd capability clamping voltage 80 pf v kv 6.1 7.1 8 peak pulse power w 80 leakage current ua 1.0 60 8 operation temperature 125 c forward voltage v 1.2 0.1 conditions i r = 1ma v r = 0v ,f = 1mhz i pp = 1a,t p =8/20us c = 150 p f , r = 300ohm, forward and reverse 10 pulses v r = 3v i f = 5ua i pp = 8a,t p =8/20us 10 symbol v bd c t v c esd p pp i l t j v f storage temperature t stg c 150 -55 smd esd protection diode maximum rating and electrical characteristics (at t a=25c unless otherwise noted)
f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t w a v e f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 t ime (us) i p p m 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 1 0 2 0 3 0 4 0 8 us to 100% 20 us to 50us p o w e r r a t i n g ( % ) o ambient temperature ( c) mounting on glass epoxy pcbs ra ting and characteristic cur ves ( ) cpdh3-5v0u 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 c l a m p i n g v o l t a g e , v c ( v ) f i g . 3 - c l a m p i n g v o l a t a g e v s . p e a k p u l s e c u r r e n t peak pulse current,i pp (a) 8 2 0 8 10 12 4 6 6 4 2 0 8/20us waveform 2 5 5 0 7 5 1 0 0 1 5 0 0 1 2 5 f=1mhz o t a =25 c 0 20 40 60 80 0 1 2 3 5 4 100 c a p a c i t a n c e b e t w e e n t e r m i n a l s ( p f ) reverse voltage (v) f i g . 4 - c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r is t i c s f ig . 2 - p o w e r r a ti n g d e r a ti n g c u r v e page 2 rev :c comchip t echnology co., l td. qw -bp014 smd esd protection diode
b c d d d 2 d 1 s o t - 5 2 3 s y m b o l a ( m m ) ( i n c h ) 1 . 9 6 9 m i n . 1 . 8 0 0 . 1 0 1 . 8 0 0 . 1 0 4 . 0 0 0 . 1 0 1 . 5 5 0 . 1 0 3 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 5 0 . 0 m i n . 1 3 . 0 0 . 2 0 0 . 9 0 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 0 5 8 . 0 0 0 . 3 0 1 4 . 4 m a x . 1 7 8 1 page 3 rev :c comchip t echnology co., l td. qw -bp014 0 . 0 7 1 0 . 0 0 4 0 . 0 7 1 0 . 0 0 4 0 . 0 3 5 0 . 0 0 4 0 . 0 6 1 0 . 0 0 4 7 . 0 0 8 0 . 0 4 0 0 . 5 1 2 0 . 0 0 8 s o t - 5 2 3 s y m b o l ( m m ) ( i n c h ) 0 . 3 1 5 0 . 0 1 2 0 . 1 3 8 0 . 0 0 2 0 . 0 6 9 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 2 0 . 5 6 7 m a x e f p p 0 p 1 w w 1 smd esd protection diode o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed reel t aping specification i n d e x h o l e d e f b w p p 0 p 1 a
page 4 rev :c comchip t echnology co., l td. qw -bp014 suggested p ad layout marking code size (inch) 0.031 (mm) 0.80 1.00 1.24 0.039 0.049 sot -523 2.04 0.080 a b c d part number cpdh3-5v0u marking code e5u e5u 3 1 2 smd esd protection diode a c b d standard packaging c a s e t y p e 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k s o t - 5 2 3
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